Services / Test Capabilities / BGA Inspection

The BGA-300 Inspection Tools. These tools allow high magnification viewing underneath BGA and other SMT packages.

The compact, handheld systems are easy to carry through the factory or to different facilities.

The 2 mm prism and optional 1 mm prism allow inspection even on very densely populated boards.

 

Cracked solder joint Non-contact between ball and pad 
   
Solder paste did not fully reflow  Broken solder joint 

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