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Manufacturing

Great ideas require great execution. CEC’s manufacturing service specializes in the creation of products that demand high reliability in the most challenging environments. Our scalability allows us to develop products that minimize the time to market without compromising quality, reliability and design.

Our customer focus and dedication to excellence in electronic design, manufacturing and after-market support has resulted in proven success in the Electronic Manufacturing Service industry.

Our state-of-the-art facility is equipped with tools to ensure reliable and high quality output. This investment together with the right blend of expertise enables us to partner with you for high-mix, high-complexity board-level manufacturing.g

New Product Development

Our Printed Circuit Board (PCB) design and layout service enables us to project manage your new product introduction right from the start.

Our multi-skilled engineers provide input to all new PCB product designs we are involved with to ensure that your board is best prepared for manufacture and test.

Wire Harness and Cable Assembly

State of the art cable assembly preparation equipment and highly experienced staff are at the heart of our service operations.

Our state of the art EcoStrip 9300 automatic wire cutting and stripping machine with a Schleuniger prefeeding machine and a hotstamp marking machine ensures a consistent quality that is second to none.

High-mix, high-complexity board-level manufacturing requires the right blend of capacity and expertise. At Cygnus, we provide just that.

Our state-of-the-art technology, and experienced and certified personnel, deliver turnkey solutions to our customers.

We employ standardized processes and methodologies across all manufacturing facilities, ensuring consistency in product, in service capabilities, and in quality.

Moreover, our customer-focused teams manage a product’s evolution, and guide improvements, over its entire life cycle.

Manufacturing

Printed Circuit Board Assembly

Surface Mount Assembly 
Our ISO 9001 production facility offers3 high speed line with Ultra fine pitch high speed Samsung Neo CP45 assembly line with 3 heads on the fly alignment capable of place components as small as 0201 to BGA and Micro BGA, and 2 Panasonic fine pitch lines with 2 high speed chip shooters.

The total component placement rate is approximately 50,000 per hour.

We utilize MPM screen printers that use computer controlled visual fiducial alignment for precise solder placement. Also all our BGA will be inspected using Glenbrook X-ray Inspection Machine.

SMT Samsung

Cygnus Uses Samsung SMT lines

CP45 NEO Series

The CP45 NEO Series Advanced Flexible Component Placer from Samsung combines
a range of features designed to enhance your productivity. Combining digital illumination and multi-camera advanced vision with high-speed CSP placement on a stable, reliable platform increases your production efficiency.

Outstanding Flexibility
The fully programmable digital illumination system is optimized for each component shape, enhanced by the wide range of cameras, ranging from 20mm 45mm, for high-precision placement of components up to 1.65 in including QFP and 0.011 in fine pitch. The CP45 NEO Series includes two standard feeder bases for a maximum capacity of 104 x 8mm tape feeders, safely placing smallest 0201 to 32mm square components.

Advanced Flying Vision System
The CP45 NEO Series’ true “on-the-fly” vertical alignment system centers components during transit between picking up the device and placement. Individual cameras for each of the six heads help achieve placement speeds up to 20,200 CPH.

Upward Looking Vision
with Digital Illumination System
The CP45 Neo’s upward looking camera system increases your success by using straight-line optics for inspection of QFP, CSP, BGA’s or fine pitch devices.

The fully programmable illumination system comes with optimized settings for each component shape. Multi-angle lighting is digitally controlled and offers 16 levels of illumination, suitable for all type of components.


Contract Assembly
Material for assembly can be either on consignment or procured by Cygnus on a turnkey basis. We have excellent worldwide industry contacts to ensure that we supply quality components from qualified vendors at competitive prices.

Manual Assembly 

We have dedicated setup lines for customers. This allows us to be flexible yet ensure full devotion to individual contracts. We provide lead forming and trimming services to ensure consistent component shaping.

Axial Lead Device Sequencing
We offer a service to combine up to 40 different axial leaded devices on to a single tape and reel. Components ranging from 1/8 W to 2 W resistors and all axial leaded capacitors (no electrolytic). Reels can be up to 14” in diameter and carry as many as 10, 000 components.

Through Hole Assembly
We have a full line of Universal Automatic Insertion Equipment for through hole and mixed technology assemblies. A Contact 400C is available for semi automatic through hole assembly. Clean or no clean solder can be used in our wave solder process. All our assemblies are fed through our inline aqueous wash using a de-ionized water source.

Prototyping

We understand how important time to market is to our customers. To this end, we can have your prototypes ready in as little as 24 hours (depending on the size and scope of the project).

With the flexibility to manage a constantly changing bill of materials, evolving PCB designs, and shifting project schedules you can count on us to build your prototype on time, every time. In addition, we will provide you with design for manufacturability feedback to help you reduce manufacturing cost and time.

System Build

We put together all the pieces that make our customers’ products a reality. We assemble and connect the printed circuit boards and backplanes that form the heart of the system. We ensure the mechanicals mesh together, and create the enclosure that protects and houses it all.

Our build-to-order and configure-to-order services assemble a product according to the needs of the individual end-customer. And we integrate the hardware and software – as well as provide functional testing and reliability analysis – to make sure it works for that end-customer right out of the box.

Conformal Coating

Conformal coatings protect electronic printed circuit boards from moisture and contaminants, preventing short circuits and corrosion of conductors and solder joints. They also minimize dendritic growth and the electromigration of metal between conductors. In addition, the use of conformal coatings protects circuits and components from abrasion and solvents. Stress relief is also provided, as well as protection of the insulation resistance of the circuit board.

Conformal Coatings Options

For conformal coatings, the most competitive options are materials based on: acrylics, epoxies, urethanes, parxylenes or silicones.

  • AcrylicAcrylic coatings are typically solvent based and are easily repaired. Traditionally they were low cost but have become less competitive with rising regulation requirements and safety concerns with solvent usage. They were tough, hard, and transparent – but lacked stress relieving capability. Pot life was good since additional solvent could be added to keep the bath viscosity low and they exhibited low moisture absorption and had short drying times when volatile solvents were used.
  • EpoxyEpoxy coatings are very hard, usually opaque and are good at resisting the effects of moisture. They possess excellent chemical and abrasion resistance, but can cause stress on components during thermal extremes. Cure chemistries can sometimes require extra precaution for safe handling. Fluctuating temperatures can cause considerable drift in viscosities and difficulties in controlling cure times and coating thicknesses.
  • UrethaneUrethane coatings are tough, hard and exhibit excellent resistance to solvents. Along with excellent abrasion resistance and low moisture permeability, they offer good low temperature flexibility.Their use is often prevented by their limited high-temperature capability and lack of repairability.
  • ParaxylyleneParaxylylene coatings are very uniform and yield excellent pin coverage. Their limitations include high cost, sensitivity to contaminants and the need for vacuum application technique.
  • SiliconeSilicone coatings range from elastoplastic (tough, abrasion-resistant) to soft, elastomeric (stress-relieving) materials.
    They possess the following characteristics:
    • Heat cure or RTV cure
    • Usefulness over a very wide temperature range
    • Good moisture and humidity resistance
    • Processing versatility
    • Easy repairability
    • Low toxicity

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